Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump
نویسندگان
چکیده
منابع مشابه
Copper/solder intermetallic growth studies.
Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...
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The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstruct...
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Electromigration tests of SnAg solder bump samples with 15 μm bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45 ˆ 104 A/cm2 at 185 ̋C and 1.20 ˆ 104 A/cm2 at 0 ̋C. A porous Cu3Sn intermetallic compound (IMC) structure was observed to form within the bumps after several hundred hours of current stressing. In direct comparison, annealing alone at 185 ...
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This paper presents a fluid–structure interaction (FSI) analysis of ball grid array (BGA) package encapsulation. Real-time and simultaneous FSI analysis is conducted by using finite volume code (FLUENT) and finite element code (ABAQUS), which are coupled with MpCCI. A BGA integrated circuit (IC) package with different solder bump arrangements is considered in this study. In the FSI analysis, ef...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2011
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.m2011058